发明名称 |
WIRING MATERIAL AND WIRING BOARD USING THE SAME |
摘要 |
A wiring material for TFT-LCD which comprises an Ag alloy containing Ag and Zr as essential components and further one or more metals selected from the group consisting of Au, Ni, Co and Al; and a wiring material which comprises a Cu alloy comprising Au and/or Co and Cu, wherein the alloy has a Cu content of 80 to 99.5 wt % and the sum of a Au content and a Co content of 0.5 to 20 wt %. A film formed using a wiring material comprising the above alloy comprising Ag (or Cu) on a glass substrate or a silicon wafer by the sputtering method has exhibited satisfactorily low electric resistance and also satisfactorily high adhesion strength to the substrate or the wafer. |
申请公布号 |
WO03098641(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
WO2003JP04690 |
申请日期 |
2003.04.14 |
申请人 |
IDEMITSU KOUSAN CO., LTD.;INOUE, KAZUYOSHI |
发明人 |
INOUE, KAZUYOSHI |
分类号 |
C22C5/06;C22C5/08;C22C9/00;C22C9/06;G02F1/1362;H01B1/02;H01L21/285;H01L21/86;H01L23/498;H01L23/532;H01L29/45;H01L29/49;(IPC1-7):H01B1/02;H01L29/786;G02F1/134;H01B5/14;H01L21/28 |
主分类号 |
C22C5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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