| 发明名称 |
SCHALTUNGSVEREINZELUNGSSYSTEM UND VERFAHREN |
| 摘要 |
Electronic circuits such as IC packages, circuit boards, of flex circuits are singulated by laser cutting of adjoining laminated material. The laser beam has a wavelength of less than 400 nm, and either a minimum energy density of 100 J/cm2 or a minimum power density of 1GW/cm2. The method avoids the need for cleaning and intermediate handling, and there is a greatly improved throughput. |
| 申请公布号 |
DE60006127(D1) |
申请公布日期 |
2003.11.27 |
| 申请号 |
DE2000606127 |
申请日期 |
2000.08.03 |
| 申请人 |
XSIL TECHNOLOGY LTD., DUBLIN |
发明人 |
CONLON, PETER;MAHON, JAMES;BOYLE, ADRIAN;OWEN, MARK |
| 分类号 |
B23K26/00;B23K26/04;B23K26/06;B23K26/073;B23K26/14;B23K26/40;B23K101/42;H01L21/00;H01L21/48;H05K1/02;H05K3/00 |
主分类号 |
B23K26/00 |
| 代理机构 |
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代理人 |
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