发明名称 Adhesive compositions for bonding passive substrates
摘要 Adhesive compositions are disclosed which cure rapidly and completely on confinement between passive substrates, such as magnesium alloys, that are deficient in transition metals and transition metal ions. The compositions include one or more acrylate resins, one or more peroxy free radical initiators, one or more onium salts, and an accelerator such as acetylphenyl hydrazine desirably in an amount of about 1.0% or less by weight of the composition. These compositions provide exceptional bonding to such substrates without the need for a transition metal primer. Methods of making and using such compositions are also disclosed.
申请公布号 US2003217808(A1) 申请公布日期 2003.11.27
申请号 US20020258862 申请日期 2002.10.29
申请人 WOODS JOHN;MORRILL SUSANNE;DANHEISER RICK 发明人 WOODS JOHN;MORRILL SUSANNE;DANHEISER RICK
分类号 C09J4/00;C09J4/02;C09J4/06;C09J175/14;(IPC1-7):C09J1/00 主分类号 C09J4/00
代理机构 代理人
主权项
地址