发明名称 METHOD FOR PROCESSING ELECTRICAL PARTS, PARTICULARLY FOR PROCESSING SEMICONDUCTOR CHIPS AND ELECTRICAL COMPONENTS, AND DEVICE FOR CARRYING OUT SAID METHOD
摘要 The invention relates to a novel method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and a device for carrying out the inventive method.
申请公布号 WO03098665(A1) 申请公布日期 2003.11.27
申请号 WO2003DE01152 申请日期 2003.04.09
申请人 SILLNER, GEORG, RUDOLF 发明人 SILLNER, GEORG, RUDOLF
分类号 H01L21/50;H01L21/00;H01L21/683 主分类号 H01L21/50
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