发明名称 COPPER-NICKEL-SILICON TWO PHASE QUENCH SUBSTRATE
摘要 <p>A copper- nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide, phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.</p>
申请公布号 WO2003097886(P1) 申请公布日期 2003.11.27
申请号 US2003015665 申请日期 2003.05.15
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