| 发明名称 |
DIE ATTACH ADHESIVES WITH EPOXY RESIN HAVING ALLYL OR VINYL GROUPS |
| 摘要 |
Adhesive compositions containing a base resin and an epoxy resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications. |
| 申请公布号 |
SG99913(A1) |
申请公布日期 |
2003.11.27 |
| 申请号 |
SG20010004052 |
申请日期 |
2001.07.05 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
MARK R. BONNEAU;YUN K. SHIN;GINA HOANG;MARTIN SOBCZAK |
| 分类号 |
C09J157/00;C08F290/06;C09J163/00;C09J163/02;C09J163/10;C09J201/00;C09J201/02;C09J201/10 |
主分类号 |
C09J157/00 |
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