发明名称 Package method for enhancing the brightness of LED
摘要 The invention provides a package method for enhancing the brightness of an LED, and the package method comprises the following steps: planarizing a surface of the mount; forming a reflection mirror on the surface of the mount; and attaching an LED chip to the mount.
申请公布号 US2003219919(A1) 申请公布日期 2003.11.27
申请号 US20020255877 申请日期 2002.09.25
申请人 WANG DER-NAN;CHEN LUNG-HSIN 发明人 WANG DER-NAN;CHEN LUNG-HSIN
分类号 H01L33/48;H01L33/60;(IPC1-7):H01L21/00 主分类号 H01L33/48
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