| 摘要 |
A heat transfer device includes a thermal superconducting body, which has a hollow heat transfer body and a heat transfer layer. The hollow heat transfer body is made of a heat conductive material and has a flat top portion and a flat bottom portion connected to the flat top portion and cooperating with the flat top portion to form a sealed vacuum receiving space therebetween. The heat transfer layer is made of a thermal superconductor material, is disposed in the vacuum receiving space, and forms a superconductor lining on an inner wall surface of the heat transfer body.
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