METHODS FOR MICROSCALE LASER SHOCK PROCESSING OF METAL THIN FILMS
摘要
The present invention relates to techniques for microscale shock processing (LSP), in particular relating to processing of thin metal films which increases the reliability of metal used in applications such as micro-electromechanical structures (MEMS). The present invention includes methods for modeling and characterization in connection with microscale LSP of tin metal films.
申请公布号
WO03097291(A1)
申请公布日期
2003.11.27
申请号
WO2003US15701
申请日期
2003.05.16
申请人
THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OFNEW YORK;ZHANG, WENWU;YAO, Y., LAWRENCE