发明名称 |
CHIP CARD MODULE AND METHOD FOR ITS MANUFACTURE, AND ALSO CHIP CARD INCORPORATING SUCH MODULE |
摘要 |
FIELD: semiconductor modules and chip cards. SUBSTANCE: chip card module has semiconductor chip electrically connected to metal frame provided with contact pads. Semiconductor chip is electrically connected to contact pads through leads disposed on surface of insulating layer applied to semiconductor chip and presented from the latter. Leads and contact pads can be brought in contact by means of soldered or conducting adhesive joints. In addition invention concerns chip card incorporating proposed model. EFFECT: facilitated manufacture and minimal height of module which makes surface of chip card incorporating it flat and free from bulges and depressions. 10 cl, 3 dwg |
申请公布号 |
RU2217795(C2) |
申请公布日期 |
2003.11.27 |
申请号 |
RU19990120781 |
申请日期 |
1998.02.06 |
申请人 |
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发明人 |
UDO DETLEV;PJUSHNER FRANK;SHTAMPKA PETER;KHUBER MIKHEL';KHAJTTSER JOZEF;MUNDIGL JOZEF |
分类号 |
B42D15/10;G06K19/077;(IPC1-7):G06K19/077 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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