| 摘要 |
The present invention relates to a carrier module for micro-BGA (mu-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a mu-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.
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