| 摘要 |
Disclosed is a clamping device (1) for clamping semiconductor components (12) to a mounting plate (2). The inventive clamping device (1) comprises a pressing plate (9) that is disposed axially opposite the mounting plate (2) and is movable in axial direction, tie rods which are connected to the mounting plate (2) and are arranged so as to support the pressing plate (9), a clamping unit (3) for producing contact pressure, and a spring element (18) sustained by the clamping unit (3). A pressure transmission means transmits the contact pressure to the pressing plate (9). In order to introduce the contact pressure as two-dimensionally and evenly as possible across the pressure surface into the semiconductor element, the pressure transmitting means is a fluid arranged in a pressure-proof pressure chamber (19) which is partially delimited by the pressing plate. |
