Process for applying a semiconductor chip on a thermal and/or electrically conducting connecting part arranged in or on a plastic housing body comprises using a soft soldering process

摘要

Process for applying a semiconductor chip (9) on a thermal and/or electrically conducting connecting part (12) arranged in or on a plastic housing body (5) comprises using a soft soldering process. Independent claims are also included for the following: (1) Optoelectronic semiconductor component; and (2) Process for the production of the optoelectronic semiconductor component.