发明名称 |
Miniaturized contact spring |
摘要 |
This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.
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申请公布号 |
US2003218244(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
US20030390988 |
申请日期 |
2003.03.17 |
申请人 |
LAHIRI SYAMAL KUMAR;SWIATOWIEC FRANK;CHONG FU CHIUNG;MOK SAMMY;CHIEH ERH-KONG;MILTER ROMAN L.;HAEMER JOSEPH M.;LIN CHANG-MING;CHEN YI-HSING;DOAN DAVID THANH |
发明人 |
LAHIRI SYAMAL KUMAR;SWIATOWIEC FRANK;CHONG FU CHIUNG;MOK SAMMY;CHIEH ERH-KONG;MILTER ROMAN L.;HAEMER JOSEPH M.;LIN CHANG-MING;CHEN YI-HSING;DOAN DAVID THANH |
分类号 |
B81B3/00;G01R1/067;G01R3/00;H01L23/48;H01R13/24;H05K3/40;H05K7/10;(IPC1-7):H01L23/48 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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