Surface protecting adhesive film for semiconductor wafer and processing method for semiconductor wafer using said adhesive film

摘要

An adhesive film for protecting the surface of a semiconductor wafer wherein the adhesive layer is formed on one surface of a substrate film, the substrate film comprising at least one layer which satisfies the following requisites (A) and at least one of (B) or (C): requisite(A): high elastic modulus properties in which the storage modulus is 1x10<9 >Pa to 1x10<10 >Pa under the total temperature range of from 18 to 50° C. requisite(B): high elastic modulus properties in which the storage modulus within at least part of the temperature range of from 50 to 90° C. is not more than 1x10<8 >Pa. requisite(C): high elastic modulus properties with expansibility by water absorption in which the size-changing ratio by absorbing water for four hours is 0.05 to 0.5% at 23° C. and 90% RH.