摘要 |
A method of encapsulating an organic electroluminescent (EL) device. The method includes applying a first sealant to a portion of an encapsulation plate facing a substrate to define one selected from a plurality of organic EL devices formed on the substrate, each including a first electrode layer, organic layers, and a second electrode layer. A space produced by the encapsulation plate and the first sealant and having an open face is filled with a second sealant. The substrate and the encapsulation plate are bonded together by applying pressure. The first sealant and the second sealant are then cured. The substrate and the encapsulation plate are cut into a plurality of independent organic EL panels.
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