| 摘要 |
<p>A semiconductor chip (9) transmitting or receiving a radiation is soft soldered for mounting on a leadframe (2) which is injection molded with a prefabricated plastic housing body (5), a so-called premolded package. By using a low melting solder (3) that is applied in a layer thickness of less than 10 µm, the soldering process can be carried out to a large extent without any thermal damage to the plastic housing body (5).</p> |
