| 摘要 |
<p>A laminated substrate, a method of manufacturing the substrate, and wafer outer periphery pressing jigs, the laminated substrate wherein a defective laminated portion on the outer peripheral part of an active layer is removed by polishing after surface grinding; the method of manufacturing the substrate comprising the steps of, after the surface grinding, removing and polishing the outer peripheral part of a laminated wafer (30) from an active layer wafer (10) side while leaving the center part thereof, whereby conventional outer periphery grinding and outer periphery etching can be eliminated, and etch pits on the outer peripheral surface of a wafer (20) by outer peripheral etching and contamination and damage to an SOI layer (10A) due to failure to remove silicone oxide film (10a) can be eliminated to increase a yielding and reduce a cost.</p> |
