| 摘要 |
PCT No. PCT/CH98/00231 Sec. 371 Date Oct. 25, 1999 Sec. 102(e) Date Oct. 25, 1999 PCT Filed Jun. 2, 1998 PCT Pub. No. WO98/56019 PCT Pub. Date Dec. 10, 1998A method of producing a transponder (20) comprising the following steps: demarcating the various turns (8) of a coil in a sheet (1), including a dielectric substrate covered by at least one conducting layer (2), by stamping said conducting layer with a stamping die (5) having sharp-edged surfaces (6) for contact with the superficial conducting layer (2; 2'''), connecting at least one electronic component (25) to the turns (8), and mounting at least one protective sheet (22; 27) covering the coil and the electronic component (25). To facilitate the stamping and to obtain clean incisions, the conducting layer is covered, before stamping, with a synthetic film. To prevent short circuits over the incisions, the incisions are preferably filled in with an adhesive, varnish or lacquer. |
