METHOD FOR REJECTING INTEGRATED CIRCUITS

摘要

FIELD: rejecting encapsulated integrated circuits. SUBSTANCE: proposed method is used for comprehensive nondestructive quality control of integrated circuits by inspecting them for corrosion-encouraging dirt on chips of encapsulated integrated circuits. To this end the latter are exposed to external effects (in our case to high and low temperatures) to detect changes in informative parameter whose value shows if aluminum layer deposited on chip is affected by corrosion or not. Exposure time and number of cyclic effects are calculated by using permissible leaks on circuit, changes in internal free space as function of temperature, and amount of aluminum on naked contact pads. EFFECT: provision for nondestructive quality control without introducing unwanted defects and with use of simple equipment. 1 cl