发明名称 PRINTED WIRING BOARD
摘要 <p>A printed wiring board (10) comprising a printed wiring board basic material (12), a conductive pattern formed on the printed wiring board basic material to constitute circuit lines (1) and pads (4) being connected with the circuit lines, and an insulating material (3) covering the printed wiring board basic material and the conductive pattern, wherein the region of the conductive pattern exposed through an opening (2) formed in the insulating material is used as the pad. Opposite ends (22) of the opening in the first direction (Y) extends beyond the conductive pattern to the outside thereof and thereby the end part of the pad in the first direction is determined by the conductive pattern. Opposite ends (21) of the opening in the second direction (X) orthogonal to the first direction extends to intersect the conductive pattern and thereby the shape of the pad in the second direction is determined by the opposite ends of the opening in the second direction.</p>
申请公布号 WO2003098983(P1) 申请公布日期 2003.11.27
申请号 JP2003006192 申请日期 2003.05.19
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