发明名称 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
摘要 <p>In a controller MC, information on a process room (PM) (last process PM) which conducted a process last for the previous lot is stored. When starting processing for the current lot, the semiconductor wafers W are loaded in process rooms, beginning with the process room next to the last process PM (for example, a process room (PM2) when the last process PM is a process room (PM1)). This allows the processors to be used evenly and minimizes variations in maintenance cycles and in the wearing of parts in the processors.</p>
申请公布号 WO2003098684(P1) 申请公布日期 2003.11.27
申请号 JP2003005597 申请日期 2003.05.02
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