Integrated circuit chip for consumer, commercial, industrial applications, has test element group circuit connected to test pad for measuring electrical characteristics of semiconductor devices of internal circuit

摘要

#CMT# #/CMT# The chip has pads (20,21) connected to an internal circuit (19) comprising interconnected semiconductor devices to provide integrated circuit functionality. A test element group (TEG) circuit (23) measures electrical characteristics of the semiconductor devices and is connected to a TEG pad (22). A lead frame is electrically connected to the pads but not to the TEG pads. #CMT# : #/CMT# An independent claim is also included for a method of testing an integrated circuit chip. #CMT#USE : #/CMT# Used for consumer, commercial and industrial applications. #CMT#ADVANTAGE : #/CMT# The TEG circuit is placed in the same integrated chip for accurately measuring the electrical characteristics of the semiconductor devices and hence reduces time consumption. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a top view of an integrated circuit wafer. 19 : Internal circuit 20,21 : Pads 22 : TEG pad 23 : TEG circuit 24 : Power supply line.