| 发明名称 |
REDUCED FOOTPRINT TOOL FOR AUTOMATED PROCESSING OF SUBSTRATES |
| 摘要 |
The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways. |
| 申请公布号 |
WO03043060(A3) |
申请公布日期 |
2003.11.27 |
| 申请号 |
WO2002US35998 |
申请日期 |
2002.11.08 |
| 申请人 |
FSI INTERNATIONAL, INC. |
发明人 |
LARSON, ROBERT, E.;SIMONDET, SEAN, D.;ZIMMERMAN, DAVID, C.;MACIEJ, TODD, K.;MATTHYS, QUIRIN, W. |
| 分类号 |
B65G49/07;H01L21/00;H01L21/02;H01L21/304;H01L21/677 |
主分类号 |
B65G49/07 |
| 代理机构 |
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