发明名称 |
Method of transferring a laminate and method of manufacturig a semiconductor device |
摘要 |
An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.
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申请公布号 |
US2003217805(A1) |
申请公布日期 |
2003.11.27 |
申请号 |
US20030438854 |
申请日期 |
2003.05.16 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO. , LTD. |
发明人 |
TAKAYAMA TORU;GOTO YUUGO;MARUYAMA JUNYA;OHNO YUMIKO |
分类号 |
H01L21/20;H01L21/762;(IPC1-7):B32B31/00 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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