发明名称 Semiconductor integrated circuit device with test element group circuit
摘要 Disclosed is a semiconductor integrated circuit device which includes a test element group circuit connected between a first and a second pad. The test element group circuit includes a plurality of semiconductor devices connected in series between the first and second pads. At least two adjacent ones of the semiconductor devices are connected to each other via a signal path that is formed by a multi-layer interconnection structure.
申请公布号 US2003218255(A1) 申请公布日期 2003.11.27
申请号 US20030346019 申请日期 2003.01.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK CHUL-SUNG;NOH YONG-HWAN;LEE BYONG-KWON;YANG HYANG-JA
分类号 H01L21/66;G01R31/28;H01L23/544;(IPC1-7):H01L23/48 主分类号 H01L21/66
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