Polishing apparatus

摘要

A workpiece such as a semiconductor wafer (6) is supported on a top ring (3) and polished by an abrasive cloth (23) on a turntable (20) while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft (1), coupled to a pressure cylinder (12) for pressing the top ring, and coupled to a motor (13) for rotating the top ring. A spherical bearing is interposed between the top ring (3) and the top ring drive shaft (1) for allowing the top ring to follow tilted surface of the moving turntable. A torque transmitting mechanism (7,8) is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.