Submount assembly packaging method

摘要

A method of packaging an electro-optic system comprising the steps of: defining at least one registration feature on a first surface (18a) of a submount (18); mounting a submount assembly (10), including the submount (18) upon a support surface of a package (36), wherein the package (36) includes a plurality of conductive pins (38) surrounding the support surface; establishing electrical connections between the conductive pins (38) of the package (36) and respective leads of the submount assembly (10); and mounting a component upon the submount (18) in alignment with the registration feature defined on the first surface (18a) of the submount (18) following the steps of mounting the submount assembly (10) in the package (36) and establishing electrical connections therewith.