| 发明名称 |
Production method for semiconductor devices using resin molding mold |
| 摘要 |
A resin molding die includes: a cavity; a resin inlet through which a liquid resin to be cured is injected into the cavity; and an air vent through which air is released to an exterior space of the resin molding die during injection of the resin, the air vent being provided on an opposite side from the resin inlet with respect to the cavity.
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| 申请公布号 |
US6652795(B2) |
申请公布日期 |
2003.11.25 |
| 申请号 |
US20010799360 |
申请日期 |
2001.03.06 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
KONISHI MASAHIRO;ORITA HIROKI;TAKADA TOSHIYUKI |
| 分类号 |
B29C45/34;B29C33/10;B29C39/10;B29C45/14;B29C45/77;B29C45/78;B29K101/10;B29L31/34;H01L21/56;(IPC1-7):B29C45/14;B29C70/70 |
主分类号 |
B29C45/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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