| 摘要 |
In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. The thermal conductor is placed on the silicon layer after the silicon layer has been bonded to the substrate layer. A spacer is used between the substrate and the thermal conductor. The spacer can facilitate heat transfer from the die. The spacer facilitates force transfer from the thermal conductor to the die. In an embodiment, the thermal conductor can be removed and a second thermal conductor used to further facilitate heat transfer. In an enablement, a heat sink and heat sink interface are provided and further facilitate heat transfer from the package. The specification also teaches an integrated circuit package manufactured by the method taught. The specification also teaches a computer system including an integrated circuit package manufactured by the method taught.
|
