| 摘要 |
At least one semiconductor element is located on an electrically conducting conductor strip. Around the conductor strip and the at least one semiconductor element, a housing made of a molding material is arranged such that there are still frame sections of the conductor strip outside the housing. An enlarged frame section of the conductor strip is widened so as to extend into contact with, e.g. directly adjacent to or even protruding into the housing, in order to prevent the formation of a molding flash ridge on this housing surface. The enlarged frame section is finally removed. The avoidance of a molding flash ridge allows the component to be suction-held by a suction needle at this housing surface.
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