发明名称 |
Dynamic slurry distribution control for CMP |
摘要 |
The invention is a slurry distribution system for controlling the distribution of slurry across a top surface of a polishing pad. The polishing pad may be supported by a platen and be part of a polishing station in a chemical mechanical polishing tool. Two juxtaposed perforated manifolds below the polishing pads are used as the primary means of controlling the distribution of slurry. A motor is used to rotate at least one of the perforated manifolds until a desired pattern of aligned perforations below the polishing pad has been achieved. By initially creating the perforations in each manifold in a particular pattern, many different patterns of aligned perforations may be obtained. Patterns may advantageously be made possible that have concentrations of aligned perforations in the center, middle and/or periphery of the manifolds. The polishing pad will have a slurry distribution corresponding to the concentration of aligned perforations in the manifolds.
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申请公布号 |
US6652366(B2) |
申请公布日期 |
2003.11.25 |
申请号 |
US20010859656 |
申请日期 |
2001.05.16 |
申请人 |
SPEEDFAM-IPEC CORPORATION |
发明人 |
DYER TIMOTHY S. |
分类号 |
B24B37/04;B24B57/02;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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