发明名称 Semiconductor laser device and method for fabricating thereof
摘要 A semiconductor laser device has on a compound semiconductor substrate at least a lower cladding layer, an active layer, an upper cladding layer and a contact layer. An upper part of the upper cladding layer and the contact layer are formed as a mesa-structured portion having a ridge stripe pattern, and both sides of the mesa structured portion are buried with a current blocking layer. The laser device includes the current blocking layer having a pit-like recess penetrating thereof and extending towards the compound semiconductor substrate, and a portion of the recess other than that penetrating the current blocking layer being covered or buried with an insulating film or a compound semiconductor layer with a high resistivity. The compound semiconductor substrate and the electrode layer thus can be kept insulated in an area other than a current injection area, thereby non-emissive failure due to short-circuit is prevented.
申请公布号 US6654396(B1) 申请公布日期 2003.11.25
申请号 US20000580961 申请日期 2000.05.30
申请人 SONY CORPORATION 发明人 HOSHI NOZOMU;NAGASAKI HIROKI
分类号 H01S5/00;H01S5/22;H01S5/223;H01S5/227;(IPC1-7):H01S5/00 主分类号 H01S5/00
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