| 摘要 |
PROBLEM TO BE SOLVED: To prevent malfunction of a semiconductor element due to intrusion of a noise into the semiconductor element. SOLUTION: A package for a semiconductor element is constituted of an insulating substrate 1 having a mount part 1a on which a semiconductor element 3 is mounted and a wiring layer 5 whose one edge side the electrode of the semiconductor element 3 is connected to, and whose other edge side an outside electric circuit is connected to and a cover body 2. The semiconductor element 3 is air-tightly housed in a container constituted of the insulating substrate 1 and the cover body 2. In this case, the insulating substrate 1 is made of an SiO2 -Al2 O3 -MgO-ZnO-B2 O2 system crystal glass, and magnetic powder is included in at least one part of the wiring layer 5 so that a magnetic area can be formed. |
