发明名称
摘要 PURPOSE:To prevent the sagging of a metallic small-gage wire by forming a second insulating layer having a thick 'layer onto the peripheral section of a connection region. CONSTITUTION:A first insulating layer 5 is composed of silicon nitride, etc., and formed onto the surface of a substrate 1 through a CVD method, etc., within a range except a light-emitting region 4, and layer thickness is thinned as 0.05-0.3mum. An electrode 6 consists of aluminum, etc., is brought into ohmic- contact with the light-emitting region 4 and is formed onto the first insulating layer 5 through evaporation, etc., and has connection regions 7a-7f for bonding wires. A second insulating layer 8 is made up of an organic insulating material such as a polyimide polymer, and formed onto the electrode 6 including at least connection-region peripheral sections 9a-9f within a range except the connection regions 7a-7f of the electrode and a section near the light-emitting region 4. The upper section of the electrode 6 is spinner-coated with the second insulating layer 8, photolithography is conducted, and the insulating layer 8 is heated and cured at approximately 350 deg.C, thus obtaining a thick film. Layer thickness is shaped thickly as 1-3mum. Accordingly, the sagging of a metallic-gage wire can be prevented.
申请公布号 JP3469592(B2) 申请公布日期 2003.11.25
申请号 JP19920039501 申请日期 1992.02.26
申请人 发明人
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/08;H01L33/30;H01L33/36;H01L33/48 主分类号 B41J2/44
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