发明名称 |
Interconnection structure and method for fabricating same |
摘要 |
An interconnection structure preferably including one or more conductors that have a central region filled with an insulator, and a method of fabricating such an interconnection structure for preferably making an electrical connection to the conductor(s). The method preferably includes the steps of depositing and patterning a first insulator over a substrate to form an aperture opening to the substrate; depositing and polishing a first conductor to leave the first conductor in the aperture; depositing and patterning a second insulator to form an opening through the second insulator and a recess in the aperture; depositing one or more second conductors to line the opening and the recess, and to form a central region of the interconnection structure; depositing a third insulator to at least partially fill the central region; and making an electrical connection to the second conductor(s).
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申请公布号 |
US6653737(B2) |
申请公布日期 |
2003.11.25 |
申请号 |
US20020159181 |
申请日期 |
2002.05.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORAK DAVID V.;KLAASEN WILLIAM A.;MCDEVITT THOMAS L.;MURRAY MARK P.;STAMPER ANTHONY K. |
分类号 |
H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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