发明名称 |
System for detecting surface defects in semiconductor wafers |
摘要 |
Defects such as holes and bumps in the surface of a semiconductor wafer are detected by an optical inspection system that combines darkfield and brightfield illumination techniques. A single light stop, which forms part of the illumination system, includes a pair of openings configured to produce both a solid cone of light and a hollow of light which are simultaneously focused onto the wafer surface. The directly emanating light as well as the scattered light collected from the wafer surface produce a resultant image that is the product of darkfield and brightfield illumination. Modulation of the light beam and tilting of the light focused onto the wafer surface may be advantageously used to improved contrast and resolution of the viewed image.
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申请公布号 |
US6654109(B2) |
申请公布日期 |
2003.11.25 |
申请号 |
US20020068417 |
申请日期 |
2002.02.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD |
发明人 |
LI LAIN-JONG;KO CHUNG-CHI;JANG SYUN-MING |
分类号 |
G01N21/95;(IPC1-7):C01N21/88 |
主分类号 |
G01N21/95 |
代理机构 |
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地址 |
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