发明名称 Method of forming inside rough and outside smooth HSG electrodes and capacitor structure
摘要 A container capacitor and method of forming the container capacitor are provided. The container capacitor comprises a lower electrode fabricated by forming a layer of doped polysilicon within a container in an insulative layer disposed on a substrate; forming a barrier layer over the polysilicon layer within the container; removing the insulative layer to expose the polysilicon layer outside the container; nitridizing the exposed polysilicon layer at a low temperature, preferably by remote plasma nitridation; removing the barrier layer to expose the inner surface of the polysilicon layer within the container; and forming HSG polysilicon over the inner surface of the polysilicon layer. The capacitor can be completed by forming a dielectric layer over the lower electrode, and an upper electrode over the dielectric layer. The cup-shaped bottom electrode formed within the container defines an interior surface comprising HSG polysilicon, and an exterior surface comprising smooth polysilicon.
申请公布号 US6653199(B2) 申请公布日期 2003.11.25
申请号 US20010973505 申请日期 2001.10.09
申请人 发明人
分类号 H01L21/02;(IPC1-7):H01L21/824;H01L21/20 主分类号 H01L21/02
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