| 摘要 |
A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a base, wherein the chip includes a conductive pad, the conductive trace is proximate to the pad, the base contacts and covers the conductive trace on a side opposite the chip, and the conductive trace and the base are different metals, etching the base to expose the conductive trace, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
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