| 摘要 |
For the cooling of electronic components on a board (2) which is located within an (EMC) shield (3), the shield (3) lying within a housing (1), a part air stream of a fan (5) in the housing wall is guided into the shield (3) by an air guide duct (13). Cooling is highly effective, and known heat-conducting elements between the components (4) and the shield (3) are dispensible.
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