Method and apparatus for disassembling joined layers

摘要

The present invention is a disassembly apparatus and method for disassembling a workpiece having at least two layers joined together by welding or other bonding processes at bonding points. The method includes the steps of securing the workpiece into a fixture to prevent movement of one of the layers. The apparatus includes a sonotrode and a holding device. The method further includes moving the sonotrode to contact the workpiece to apply a predetermined amount of contact pressure to the workpiece. The sonotrode in contact with the layer on a side opposite the anvil is then vibrated at a predetermined frequency until the layers become disassembled. An apparatus for performing the method is also disclosed.