Scrubbing assembly for wafer-cleaning device

摘要

A scrubbing assembly for a wafer-cleaning device is provided. The wafer-cleaning device is provided with a base. The scrubbing assembly comprises a scrubber, a cup and an oscillator. The scrubber is disposed on the base in a manner such that it can move between a first position and a second position. The scrubber scrubs a wafer when it locates in the first position. The cup, for receiving DI water, is disposed on the base. The scrubber locates inside the cup and contacts the DI water when it locates in the second position. The oscillator is disposed at the cup, and it vibrates the DI water when the scrubber locates inside the cup and is contact with the DI water.