ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE, AND SUBSTRATE FOR CONNECTING SEMICONDUCTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor capable of simultaneously performing superior wet heat adhesive strength durability, while holding the excellent adhesive strength and an insulation.

SOLUTION: The adhesive sheet for the semiconductor has at least one adhesive layer and at least one organic insulating film layer so that the total quantity of cations in an extracted water of the adhesive layer is 1,500 ppm or smaller.

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