MECHANISM FOR PREVENTING WARPAGE OF CIRCUIT BOARD IN REFLOW FURNACE

摘要

PROBLEM TO BE SOLVED: To solve the problem that the vertical sizes of a heating chamber and the inlet and output openings of a reflow furnace are required to be enlarged when a circuit board 3 does not use a warp preventing wire 41 provided between left and right conveyor chains 13 which transport the circuit board 3 by supporting the left and right end of the board 3 in a reflow furnace 1 in which soldering is performed on the board 3 by heating the board 3 to support the central part of the board 3 which tends to warp downward due to its own weight in a contacting state from the bottom side, because the wire 41 is lowered and retreated. SOLUTION: A retreating means moves a supporting and moving section 57 which rotatably supports a pulley 45 wound with the wire 41 in the lateral direction by means of a ball-screw mechanism 61 at the end of the wire 41, etc. Then the supporting and moving section 57 moves the wire 41 to a position directly below the conveyor chains 13 by downwardly moving the pulley 45, etc., by means of a vertically moving cylinder 67. COPYRIGHT: (C)2004,JPO