| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple and highly reliable self-aligned manufacturing process of a ridge-like waveguide semiconductor laser in which the uniformity of a preferable manufacturing process can be ensured, the potential capacity of high speed work can be imparted to an element, and the potential capacity of flip-chip bonding can be imparted to an element. SOLUTION: Before self-ending oxidation layer polishing technique is performed a thick oxidation layer is deposited at first with the thickness thereof being set larger than the height of a semiconductor ridge utilizing the technique, and the surface of the ridge-like SiOx formed by the technology is polished until flat SiOx is formed. In the polishing process, the height of a narrower SiOx ridge is reduced quickly at first, the rate of removing SiOx is reduced greatly when the surface being polished reaches the SiOx plane and the entire surface of SiOx can eventually be formed flat. When appropriate polishing conditions are selected, the flatness can be controlled by a means for depositing SiOx. COPYRIGHT: (C)2004,JPO
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