| 摘要 |
PROBLEM TO BE SOLVED: To rapidly and accurately align an imaging device with respect to a heat radiation means. SOLUTION: A CCD image sensor 10 and a signal processing chip 16 are stacked in a vertical direction and are mounted on a wiring board via a heat radiation board. By this mounting structure, a mounting area can be reduced while securing a space saving effect. The CCD image sensor 10 and the signal processing chip 16 are installed in contact with the heat radiation board 12, and therefore, heat generated by the CCD image sensor 10 and the signal processing chip 16 is radiated outside. The heat radiation board 12 is formed with screw holes 13 for aligning of the CCD image sensor 10. This mounting structure allows the rapid and accurate alignment of the CCD image sensor 10 with respect to the heat radiation board 12 which also serves as an installation member of the CCD image sensor 10. COPYRIGHT: (C)2004,JPO
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