| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which is capable of preventing a disconnection of a connection wire in a re-wiring section disposed in the most outer edge of a semiconductor device. SOLUTION: The electronic component comprises the re-wiring section 3 formed on a circuit formation face of the semiconductor device 2 provided with a plurality of electrodes 2a formed along the edge of the circuit formation face, and a pad 5 for external connection which is electrically connected with the electrode 2a by the connection wire 6 of the re-wiring section. A connection between the pad 5 in the most outer part of the periphery and the connection wire 6 is positioned in an inside part of the circuit formation face. Due to this structure, the connection wire 6 is prevented from being positioned in a stress concentrating section during deformation by thermal stress, resulting in preventing a disconnection of the connection wire in the re-wiring section. COPYRIGHT: (C)2004,JPO
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