发明名称 SEMICONDUCTOR-MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent air located outside of an apparatus from flowing into a stand-by chamber with a door is open. SOLUTION: A heat treatment apparatus 10 comprises a side-cleaning unit 50 for blowing off clean air 59 to a stand-by chamber 28 formed in a casing 11; a circulation duct 55 for returning the clean air 59 blown off into the stand-by chamber 28 and nitrogen gas 62 blown off from a nitrogen gas injection nozzle 60 to the side clean unit 50; and a maintenance door 48 mounted closably on the casing 11. In the heat treatment apparatus 10, the clean air 59 is blown off from the side clean unit 50 when the maintenance door 48 is open to keep the stand-by chamber 28 positive pressure, whereby the circulation duct 55 is closed with the aid of a damper 58. The stand-by chamber is thus kept at a positive pressure when the maintenance door is open, whereby the air outside the heat treatment apparatus is prevented from flowing into the stand-by chamber, so that particles are prevented from infiltrating the stand-by chamber. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332325(A) 申请公布日期 2003.11.21
申请号 JP20020135346 申请日期 2002.05.10
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KOTAKE SHIGERU;YANAGAWA HIDEHIRO;UMEKAWA AYAFUMI
分类号 H01L21/31;H01L21/02;(IPC1-7):H01L21/31 主分类号 H01L21/31
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