APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE WITH IMPROVED HEATER BLOCK STRUCTURE

摘要

PURPOSE: An apparatus for manufacturing a semiconductor device with an improved heater block structure is provided to be capable of preventing sliding and breakage of a wafer by using a wafer sliding prevention groove. CONSTITUTION: A heater block structure comprises a heater block(110) for loading a plurality of wafers(W), a plurality of fork assembly receiptable groove(118) formed at a wafer loading part of the heater block, and a fork assembly formed at the fork assembly receiptable grooves. At this time, the heater block structure further includes a wafer sliding prevention groove(240) located at the wafer loading part of the heater block(110).