发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 PROBLEM TO BE SOLVED: To rapidly change setting of waiting positions of an upper claw and a lower claw corresponding to the thickness of a work, in a grip mechanism used for conveying a work. SOLUTION: Waiting position contacts P1, P2 for a pair of upper claw and lower claw to be opened or closed by a cam mechanism are set on a large diameter vertex and on the small diameter vertex of a cam 21a for the upper claw. When the work is thick, the upper claw is made to wait at the waiting position contact for the upper claw set to the large diameter vertex; while when the work is thin, the waiting position contact P2 for the upper claw set to the small diameter vertex is waited so that the upper claw can be opened or closed at the gripping time of the shortest upper claw stroke, in response to the thickness of the work. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003332359(A) 申请公布日期 2003.11.21
申请号 JP20020139415 申请日期 2002.05.15
申请人 RENESAS TECHNOLOGY CORP;HITACHI TOKYO ELECTRONICS CO LTD 发明人 FUKAZAWA HARUHIKO;MAKITA YOSHIAKI;MOCHIZUKI MASAYUKI
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
代理机构 代理人
主权项
地址